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Gold plating solution - List of Manufacturers, Suppliers, Companies and Products

Gold plating solution Product List

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Electroless gold plating solution for micro bump formation "Aurexel MD"

Electroless gold plating solution for micro bump formation "Aurexel MD"

Achieving the formation of microbumps with excellent in-plane uniformity through non-electrolytic gold plating!

"Aurexel MD" is a high-speed electroless gold plating solution suitable for forming microbumps on the order of a few micrometers. 【Features】 ■ Enables the formation of microbumps just a few micrometers in size using a high-speed reductive Au plating solution. ■ Cyanide-free, enabling processing under neutral conditions at low temperatures. ■ Excellent in-plane uniformity, capable of plating on independent patterns and batch processing.

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High-performance non-cyanide gold plating solution "Eco Gold HO"

High-performance non-cyanide gold plating solution "Eco Gold HO"

The sliding wear resistance required for automotive components is exceptionally good! A high hardness, glossy coating can be obtained.

"Eco Gold HO" is a non-cyanide pure gold plating solution that can maintain a glossy appearance after heat treatment. It has excellent heat resistance with a pure gold coating. It is highly resistant to wear and is suitable for contact parts. We have a wide range of achievements from decorative plating to medical and aerospace components. For more details about other products, please contact us. 【Features】 - Maintains a glossy appearance after heat treatment - Wide range of achievements in decorative plating, medical parts, and aerospace components - Extremely high wear resistance, suitable for contact parts - TI free - Hard gold *For more details, please refer to the PDF document or feel free to contact us.

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Cyanide-free immersion gold plating solution for Ni base layers "Aurexel DP"

Cyanide-free immersion gold plating solution for Ni base layers "Aurexel DP"

Achieve uniform Au thin films with a cyanide-free substitutional electroless gold plating solution!

“Aurexel DP” is a cyanide-free substitutional electroless gold plating solution for Ni substrates, offering excellent deposition uniformity and solder wettability, and enabling processing under neutral conditions at low temperatures. 【Features】 ■ Enables the formation of gold thin films using a plating solution that does not contain cyanide compounds ■ Ideal for final surface treatment of substrates and for base-layer formation in reductive gold plating. ■ Damage to the underlying nickel can be minimized through component adjustment ■ Excellent operability due to the ability to process in a neutral range and at low temperatures ■ Low gold content, providing excellent cost performance

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